박용섭
 |
| Contact Information |
| • 영문이름 : Yongsup Park • 세부전공 : 응집물리 실험 • 학 위 :Ph.D. Northwestern University • 전화번호: 02-961-0729 • 직 급 : 교수 • 한글이름 : 박용섭 • E-mail : parky@khu.ac.kr • 그룹홈페이지 : http://spond.khu.ac.kr • 홈페이지 : http://www.parky.kr/ |
| Areas of Expertise |
|
• 응집물질물리(실험): 광전자 분광기술, 표면 및 계면 분석 • 응용/반도체물리(실험): 유기 반도체 소재 및 소자 분석 |
| Education |
|
• 1994: Ph.D. in Physics, Northwestern University (USA) • 1988: M.S. in Physics, Seoul National University • 1986: B.S. in Physics Education, Seoul National University |
| Professional Experience |
|
• 2006-present: Professor, Department of Physics, Kyung Hee University • 1997-2006: Principal Researcher, Korea Research Institute of Standards and Sciences • 1994-1996: Postdoc. University of Rochester (USA) |
|
|
| Selected Publications |
| • Donghyun Ko, Gyuhyeon Lee, Kyu-Myung Lee, Yongsup Park, and Jaesang Lee, Trap-limited electrical properties of organic semiconductor devices, arXiv preprint arXiv:2302.09721 (2023) • Mingye Kim, Jae Seung Shin, Jin Hyun Ma, Jun Hyung Jeong, Dong Hee Han, Beom-Su Kim, Woojin Jeon, Yongsup Park, and Seong Jun Kang, Al-doped TiO2 interfacial layer for effective hole injection characteristics of quantum-dot light emitting diodes, J. Mater. Chem. C 10, 7294 (2022) • Seungjun Lee, Hyein Ha, Ja Yeon Lee, Hyun Kyong Shon, Tae Geol Lee, Min Chul Suh, and Yongsup Park, Degradation Mechanism of Solution-Processed Organic Light-Emitting Diodes: Sputter Depth-Profile Study, Appl. Surf. Anal. 564, 150402 (2021) • Seungjun Lee, Ji-Ho Kang, Dong A Ahn, Hyun Kyoung Shon, Tae Geol Lee, Sungkyun Park, Min Chul Suh, and Yongsup Park, Sputter Depth‐Profile Study of Accelerated Interface Mixing by Thermal Annealing in Solution‐Processed Organic Light‐Emitting Diodes, Adv. Mater. Interface 6, 1801627 (2019) • Dong A Ahn, Seungjun Lee, Jaegwan Chung, Yongsup Park, and Min Chul Suh, Impact of Interface Mixing on the Performance of Solution Processed Organic Light Emitting Diodes - Impedance and Ultraviolet Photoelectron Spectroscopy Study, ACS Appl. Mater. Interfaces 9, 22748 (2017) |